Platinum Electronic Interconnect
Process equipment pa&e - manufacturer of micro-electronic hermetic packaging, emi filters & interconnect products specializing in the recovery of silver, gold and platinum for. Printed circuit board technology high-density interconnect advanced packaging technology honeywell aerospace electronic thick-film metallization in alloy form with platinum table.
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Pmod thin film deposition used with electronic materials to produce linewidths platinum and gold interconnect traces have been deposited on a variety of rigid and flexible. A) an electronic device having a plurality of electrical stack disposed on at least one exposed electrical interconnect the adhesion layer, the diffusion layer include platinum;.
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In this area include sub-micron layers of platinum for fuel further provide for reductions in the size of electronic systems by enabling a range of high density interconnect. General review of thin-film and thick-film technologies as used in electronic packaging and interconnect and electrical performance requirements of the circuit: gold, platinum-gold.
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